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	January 6, 2006 Thumbs Up On Intel's Multibrand Future Intel's New "Leap Ahead" Brand Umbrella Gives It Room To Grow by Ted Schadler with Chris Charron

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Executive Summary

For Intel, the challenge is simple: How can the chipmaker get more Intel silicon into every digital device? The answer is to create bundled chip "platforms" and communicate each platform's potential to transform devices into digital experiences. To aid in this strategy, Intel CMO Eric Kim has elevated Intel's brand promise so that each platform can carve out its own niche under the Intel "Leap ahead" umbrella. The hard part remains: convincing manufacturers to use Intel's platforms in their devices.

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